|
Models |
PoliJet System - 9900 |
 |
| RIP |
PoliRIP V2.08 - 9900 |
| Image Rendering |
Halftone (screened 1-bit) |
| Contone (colour 8-bit) |
| Screening |
Standard PostScript Screening |
| Adobe Accurate Screening |
| Agfa Balanced Screening |
| PerfectBLEND Screening |
| Linearisation |
Yes |
| Press Dot Gain Compensation |
Yes |
| Advanced Scan LIGHT |
Optional |
| StripRITE Imposition |
Yes |
| Adobe InRip Trapping |
Optional |
| KoolToning Halftone Simulator |
Optional |
| System Requirement |
Processor - Pentium IV |
| RAM - 256 MB (Preferable 1 GB+) |
| Hard Drive - 1x40 GB (or more) |
| Operating System - Windows XP Pro (or Windows 2000 Pro) |
Imaging
Device |
PoliJet Inkjet Platesetter - 9900 |
| Imaging Technology |
Advanced Micro PiezoTM
TFP (Thin Film Piezo) drop-on-demand technology
|
| Variable-sized Droplet Technology and 3.5 pl Ultra Micro DotTM |
| Interfaces (Standard) |
USB 2.0 (Compatible with 1.1), 10/100Mb Base EthernetONT> |
| Operating Voltage |
AC 100V - 120V verison, 220V - 240V version |
| Operating Current |
1.0A for 100-120V, 0.5A for 220-240V |
| Operating Frequency |
50 - 60 Hz |
| Power Consumption (operating) |
80 W or less |
Dimension
(w x d x h) |
73" x 26" x 48" |
| 1864 x 667 x 1218 mm |
| Weight (approximately) |
116 kg / 256 lb |
| Acoustic Noise Level |
<50 dB(A) |
| Warranty |
One year. For more information please refer to www.epson.com |
| Baking Oven(PoliJet Baking Oven) |
CP - 850 |
| Fuser Type |
Conveyorised |
| Feed opening |
850mm |
| Operating Voltage |
AC 220-240 Volts |
| Operating Frequency |
50 / 60 Hz |
| Power |
1000Watts |
Dimension
(w x d x h) (mm)(including the tray dimension - as applicable) |
1160x145x650 |
| Weight (approximately) |
45 Kg / 100 lb |
| PoliJet |
PoliJet Offset Plates |
| Base Material |
Polyester |
| Coating |
Proprietory Hydrophilic Coating |
| Imaging Fluid |
Epson UltrachromeTM HDR Ink |
| Imaging Quality
|
150 lpi @ 2880 dpi with Epson Variable Dot Size Technology (max) |
| Operating Enviornment (Temperature and Humidity) |
50° to 75° F (10° to 24° C) less than 30% Relative Humidity |
| Imaging Speed (550x650mm @ 1440 dpi and 125 lpi) (approx.) |
Two sets of 4 colour seperation per hour (bi-di imaging) - 7900/9900 |
| Baking Temperature
|
Surface temperature of 110oC |
| Baking Time |
2 mins |
| Max. Plate Width |
820 mm |
| Plate Thickness |
0.15, 0.20, 0.28mm |
System Specification
